| 摘要 |
PROBLEM TO BE SOLVED: To provide an SIP type semiconductor device for specifying and detecting a connection failure between a logic chip and a memory chip, and a method for testing the semiconductor device. SOLUTION: The semiconductor device is configured of a memory chip having a plurality of memory side pads and a memory controller chip having a plurality of controller side pads connected to each of the plurality of memory side pads. The controller chip is provided with a plurality of test signal generation circuits in which each of the controller side pads is connected to an input and which generates a test signal corresponding to the level of a signal to be output from each of the controller side pads, and configured to compare a test signal to be generated by each of the plurality of test signal generation circuits with an expectation value in such a state that a signal is output to the corresponding controller side pad in a test mode. COPYRIGHT: (C)2010,JPO&INPIT
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