| 摘要 |
PROBLEM TO BE SOLVED: To provide a part mounting substrate shortening a production time and preventing the deterioration of an electronic part and a conductive portion of the substrate and preventing the positional displacement of the electronic part to the conductive portion of the substrate, and to provide a method for manufacturing the part mounting substrate. SOLUTION: The part mounting substrate 10 includes: the substrate 11; the conductive portions 12 formed on one surface 11a of the substrate 11; and the electronic part 21 connected to the conductive portions 12 and arranged on one surface 11a of the substrate 11. Terminals 22 of the electronic part 21 are pressed into the conductive portions 12, and the electronic part 21, the connections between the conductive portions 12 and the terminals 22 of the electronic part 21, and the peripheral regions of the connections in the substrate 11 are coated with an adhesive layer 31. The adhesive layer 31 consists of an ultraviolet curing type adhesive having a cure shrinkage of 3% or greater, and the adhesive layer 31 is formed in a circular shape centering around the electronic part 21 in case of a plan view to the substrate 11, and the radius of the circle is set in 10 mm or greater. COPYRIGHT: (C)2010,JPO&INPIT
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