| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and a laser beam machining apparatus that detect the material and progress of machining of an irradiation part in real time and that, on the basis of this detection result, can switch machining conditions, and to provide a multilayer printed circuit board. <P>SOLUTION: Laser beam machining is performed by converging a laser beam L emitted by a laser light source 1 and irradiating a workpiece 10 with the laser beam. During this laser beam machining, in accordance with a progress status parameter showing a material and progress of machining of an irradiation part irradiated with the laser beam L (particularly irradiation light L1) (for example, an intensity of a machining light beam (light beam including reflection light from the irradiation part and light generated in the irradiation part by laser beam machining) L11 or a rate of change of the intensity and difference of the machining light beam L11 (or the intensity and the difference of the machining light beam L11)), the machining parameter of the laser beam L (i.e., the parameter for changing energy obtained from the laser beam L, for example, intensity, pulse width and pulse interval of the laser beam L) is switched to perform the laser beam machining. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
