| 摘要 |
PROBLEM TO BE SOLVED: To provide methods of bonding materials used in the manufacture of articles, including absorbent articles such as sanitary napkins, pantiliners, tampons, absorbent interlabial devices, diapers, incontinence devices, wipes, and the like. SOLUTION: There are numerous aspects of the disclosed methods. In one aspect, improvements are made that allow the method to be used to bond through relatively thick materials (e.g., materials having a thickness of greater than or equal to 4 mm). In another aspect, the methods are provided with the ability to create a virtually unlimited number of bonding patterns in the materials to be bonded. In still another aspect, the methods of bonding utilize a compression step to improve bond formation. In still another aspect, methods of bonding that utilize a step of slitting a material through which the bonds are made are disclosed. COPYRIGHT: (C)2010,JPO&INPIT |
