| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus for heating and cooling a substrate, the heat treatment apparatus supporting the substrate while reducing the number of support pins for supporting the substrate; and to provide a heat treatment system having a plurality of heat treatment apparatuses, the heat treatment system preventing the support pins of the respective heat treatment apparatuses from contacting on the same position of the substrate. SOLUTION: The support pin 12 includes an insertion part 21 which is inserted in a hole 3 of a plate 11 of the heat treatment apparatus 1, and two projections 22 which are in contact with the substrate 9. A male screw part 212 of the insertion part 21 is screwed in a female screw part 32 of the hole 3. The heat treatment apparatus 1 can stably support the substrate 9 while suppressing the number of support pins 12 because the respective support pins 12 are in contact with two parts of the substrate 9. In the heat treatment system, arrangement directions of the projections 22 are not fixed to prevent the support pin 12 from contacting on the same position of the substrate 9 between the heat treatment apparatuses. COPYRIGHT: (C)2010,JPO&INPIT
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