| 摘要 |
The invention broadly contemplates an integrated thermal system that is capable of simultaneously cooling multiple, separate heat generating components of an electronic device. The integrated thermal system according to one embodiment of the invention takes the form of a CPU heat sink designed to intelligently maximize available airflow, utilizing multidirectional airflow cooling of a plurality of heat generating components on the motherboard. The heat sink is designed such that airflow provided by a single fan is captured and directed to nearby/adjacent components, thus cooling these components. The invention thus provides an integrated cooling solution and removes the need for multiple cooling systems/solutions.
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