发明名称 BONDING METHOD AND BONDED STRUCTURE
摘要 A bonding method includes: preparing a first base material to have liquid repellency against a silicone material-containing liquid material; applying the liquid material to a surface of the first base material to form a liquid coating in a predetermined shape, and drying the liquid coating to obtain a bonding film with the predetermined shape; imparting energy to the bonding film to develop adhesion near a surface of the bonding film, and bonding the first base material to a second base material via the bonding film, and then separating the first and second base materials from each other to transfer the bonding film to the second base material; and imparting energy to the bonding film after the transfer to develop adhesion near a surface of the bonding film, and bonding the second base material to a third base material via the bonding film to obtain a bonded structure.
申请公布号 US2010243145(A1) 申请公布日期 2010.09.30
申请号 US20100729491 申请日期 2010.03.23
申请人 SEIKO EPSON CORPORATION 发明人 IMAMURA MINEHIRO;GOMI KAZUHIRO
分类号 B32B38/10 主分类号 B32B38/10
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