发明名称 THREE-DIMENSIONAL WIRING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a three-dimensional wiring structure for easily forming a three-dimensional electronic circuit. SOLUTION: The three-dimensional wiring structure has an electronic component 3 and a wiring pattern 4 each incorporated inside a housing 2, which in turn is constituted by coupling and combining a plurality of segments 5, 6 and 7 in series, the segments 5, 6 and 7 being a pair of end segments 5 and 6 constituting both end parts of the housing 2 and at least one intermediate segment 7 disposed between the pair of end segments 5 and 6. A wall part 71 arranged inside the housing 2 is formed integrally with the intermediate segment 7, the electronic component 3 is mounted on plane wall surfaces 71a and 71b of the wall part 71, and a wiring pattern 4 is formed on each of internal surfaces 50a and 51a, 60a and 61a, and 70a of the wall surfaces 71a and 71b and segments 5, 6 and 7. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010219424(A) 申请公布日期 2010.09.30
申请号 JP20090066631 申请日期 2009.03.18
申请人 OLYMPUS CORP 发明人 SHIMIZU TOSHIYUKI
分类号 H05K1/14;H05K1/02;H05K3/32 主分类号 H05K1/14
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