| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that enhances heat dissipation properties by reducing a thermal resistance while ensuring a strength required for bonding between a submount substrate and a heat-dissipation substrate. <P>SOLUTION: The semiconductor light-emitting device 1 is configured by bonding a submount substrate 3, loaded with an LED element (a light-emitting element) 2, on a heat dissipation substrate 5 by an adhesive 4. The adhesive 4 includes a plurality of regions having different thermal conductivities and is configured to set the thermal conductivity of a region including the part immediately below the LED element 2 higher than that of another region. For example, the adhesive 4 is composed of a thermally-conductive adhesive formed by mixing a resin adhesive and a filler having a higher thermal conductivity than that of the resin adhesive. An adhesive 4A with a high thermal conductivity is coated on the region including the part immediately below the LED element 2 while a high-adhesion adhesive 4B having a filler concentration lower than that of the adhesive with a high thermal conductivity is coated on another region. <P>COPYRIGHT: (C)2010,JPO&INPIT |
