| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film deposition method and a film deposition apparatus reducing defects in film deposition in a thin film to be used in a semi-conductor device, a display device, a photo mask or the like. <P>SOLUTION: In a magnetron sputtering film deposition method for producing a thin film by which the film deposition is performed by masking a part of a target, the mask includes an area where the re-adhesion (deposition) amount on the target is larger than the sputtering amount of the target, and includes an area where the sputtering amount of the target is comparable with the re-adhesion (deposition) amount on the target. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
