| 摘要 |
An inspecting apparatus (1) obtains a pixel from among pixels of a DMD element (31) for guiding light from a wafer (W) to detecting elements (36a, 36b, 36c), based on luminance information on Fourier image obtained by detection by a two-dimensional imaging element (33) when the inspecting apparatus is set to guide all the light from the wafer (W) to the two-dimensional imaging element (33) by having all the pixels (micro mirrors) of the DMD element (31) in the on-state. Then, the inspecting device brings the obtained pixel of the DMD element (31) into the off-state, reflects a part of the light from the wafer (W) by the pixel in the off-state and guides the light to the detecting elements (36a, 36b, 36c).
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