发明名称 |
HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit. |
申请公布号 |
US2010246127(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
US20090500615 |
申请日期 |
2009.07.10 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
LIU XIN-LEI;LIU JIN-BIAO;YANG HONG-CHENG;CHEN CHUN-CHI |
分类号 |
H05K7/20;B23P11/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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