| 摘要 |
Dummy electrodes (15) are disposed on wiring connected to first electrodes (2) of the substrate (1), outside a junction region containing all of the first electrodes (2) and second electrodes (6) and in bonding resin (4), the dummy electrodes (15) not being involved in electrical connection between the substrate (1) and the component (5). When conductive particles (3) in the bonding resin (4) are melted by heating, molten solder self-assembles and solidifies between the first electrodes (2) and the second electrodes (6) and on the dummy electrodes (15). With this configuration, the solder self-assembles between the adjacent dummy electrodes (15) and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes (2) and the adjacent second electrodes (6), thereby preventing short circuits between the adjacent first electrodes (2) and the adjacent second electrodes (6). |
