| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit board, along with its manufacturing method, preventing a molten solder from spreading to the other surface side through a through hole, without increase in the number of steps. SOLUTION: Provided is: a printed wiring board 1; a first electronic component 4 secured to the printed wiring board 1 using an adhesive 6; a second electronic component 3 which includes a terminal 3a inserted in a second through hole 8b formed on the printed wiring board, and is secured to a solder surface 1b of the printed wiring board 1 by reflow soldering the terminal 3a from the soldering surface 1b of the printed wiring board 1; and a masking part 9 for masking the first through hole 8a of the printed wiring board 1 in which no terminal 3a is inserted. The masking part 9 comprises an adhesive 10. COPYRIGHT: (C)2010,JPO&INPIT
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