| 摘要 |
PROBLEM TO BE SOLVED: To reduce warpage of a multilayer wiring board when bonding a reinforcing plate to the multilayer wiring plate, in a device for bonding the reinforcing plate to the multilayer wiring board of an integrated circuit package. SOLUTION: The device has: a metallic plate on which the multilayer wiring board having the reinforcing plate temporarily fixed by an unhardened adhesive is placed and heated; and a pressure-activated bag in which the multilayer wiring board is contained. The pressure-activated bag has an inlet and an outlet of gas, and expands and contracts by supply of gas into and evacuation of gas from the bag, respectively. Contraction of the bag by evacuation of gas causes the bag to be pressed onto the reinforcing plate, and onto the portion of the multilayer wiring board other than the mounting portion of the reinforcing plate. COPYRIGHT: (C)2010,JPO&INPIT
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