| 摘要 |
PROBLEM TO BE SOLVED: To supply a sufficient chemical to a substrate and remove an object to be removed without attaching the object on the substrate in cleaning the substrate such as a semiconductor wafer. SOLUTION: The substrate cleaning apparatus includes a chemical cup 13, a first discharge port 15 for supplying the chemical in the chemical cup 13, and a liquid drain port 14 for draining the chemical from the chemical cup 13. The substrate 12 is arranged approximately horizontally in the chemical cup 13 and is separated from a bottom part of the chemical cup 13. When the chemical supplied from the first discharge port 15 is accumulated in the chemical cup 13 and is brought in contact with a lower surface of the substrate 12, the lower surface is cleaned. COPYRIGHT: (C)2010,JPO&INPIT
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