发明名称 ONE PACK ROOM TEMPERATURE MOISTURE-CURING TYPE CURABLE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable material composition which can reduce environmental loads, can ensure safety, and has a stable curing speed. Ž<P>SOLUTION: This curable resin composition comprises (1) 100 pts.mass of a curable resin (A) having dialkoxysilyl groups represented by general formula (1):-X-SiR<SP>1</SP>(OR<SP>2</SP>)<SB>2</SB>(wherein, X is a ≥2C hydrocarbon; R<SP>1</SP>is 1-20C alkyl; R<SP>2</SP>is 1-3C alkyl) in the molecule, (2) 5 to 400 pts.mass of a curable resin (B) having dialkoxysilyl groups represented by general formula (2):-W-CH<SB>2</SB>-SiR<SP>3</SP>(OR<SP>4</SP>)<SB>2</SB>[wherein, W is a group selected from among -O-CO-NH-, -N(R<SP>5</SP>)-CO-NH-, and -S-CO-NH-; R<SP>3</SP>is 1-20C alkyl; R<SP>4</SP>is 1-3C alkyl; R<SP>5</SP>is H, cyclic, linear or branched chain-like 1-18C alkyl or alkenyl or 6-18C aryl which may be substitued with one or more halogen atoms] in the molecule, wherein the total amount of the curable resin (A) and the curable resin (B) is 100 pts.mass, (3) 0.1 to 30 pts.mass of a basic compound (C), and (4) 10 to 500 pts.mass of a plasticizer (D) not containing a hydroxyl group in the molecule and having a boiling point of ≥200°C. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010215826(A) 申请公布日期 2010.09.30
申请号 JP20090065623 申请日期 2009.03.18
申请人 KONISHI CO LTD 发明人 KUSUKI KOJI;SATO SHINICHI
分类号 C08L101/10;C08K5/00;C08K5/5445;C08L33/04;C08L71/02 主分类号 C08L101/10
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