| 摘要 |
<p>A printed circuit board including a heat radiating structure with heat conducting and heat radiating ink, comprises a PCB carrier (01), at least one conducting layer (03), at least one surface insulating layer (02 ) including heat conducting and heat radiating ink, and insulating glue layer (08) including heat conducting and heat radiating ink. The upper and lower surface of the insulating glue layer (08) adheres to the conducting layer (03) and the PCB carrier (01) respectively, or adheres to the PCB carrier (01) and the conducting layer (03) respectively, or adheres to the corresponding conducting layers (03), and one surface of the surface insulating layer (02) adheres to the other surface if the conducting layer (03). The PCB may improve heat radiating effect, solve the problems that the carrier or heat radiating apparatus is too heavy, high-cost and complex to be installed, and is suitable for manufacturing rigid and flexible PCBs.</p> |
