发明名称 ELECTRONIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To more appropriately suppress separation of a sealing resin section for sealing a circuit board of an electronic circuit device and a flexible wiring board from the flexible wiring board. SOLUTION: The electronic circuit device 20 including the circuit board 22 on which electronic components 21 have been packaged includes: the flexible wiring board 23 that is adhered to the circuit board 22 and electrically connects the circuit board 22 to external equipment 100; a sealing resin section 25a made of resin that is formed so that the circuit board 22 and one portion of the flexible wiring board 23 are sealed; and a separation suppression section 30 composed of an elastic material interposed between the flexible wiring board 23 and the sealing resin section 25a along an outer periphery of the sealing resin section 25a. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010219093(A) 申请公布日期 2010.09.30
申请号 JP20090060727 申请日期 2009.03.13
申请人 AISIN AW CO LTD;TOYOTA MOTOR CORP 发明人 MURAKAMI NAOTAKA;YAMADA AKIHIRO;MATSUBARA MASATO
分类号 H01L23/29;H01L23/28;H01L23/31;H01L25/04;H01L25/18 主分类号 H01L23/29
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