| 摘要 |
PROBLEM TO BE SOLVED: To reduce a rate of occurrence of defectives both during cutting and during pickup in a semiconductor device manufacturing process by using a fixing tape that makes cuttability of a semiconductor wafer compatible with pickup properties of semiconductor chips. SOLUTION: An adhesive film 6 is stuck onto a second face (a grinding face) 1b of a semiconductor wafer 1. Then, a fixing tape 8 stretched on a wafer ring 7 is stuck onto the second face 1b of the semiconductor wafer 1 via the adhesive film 6. The fixing tape has a first soft region A1 corresponding to a wafer shape, and a second hard region A2 including a part fixed to the wafer ring 7. Semiconductor chips are formed by cutting the semiconductor wafer 1 together with the adhesive film 6. Subsequently, the semiconductor chips are picked up from the fixing tape so as to bond them onto a device constituting base material. COPYRIGHT: (C)2010,JPO&INPIT |
