| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering structure of a through-hole, which sufficiently supplies heat by heat conduction from an auxiliary through-hole to a component through-hole, and prevents solder filled in the auxiliary through-hole from overflowing onto a printed board in soldering. SOLUTION: The soldering structure of a through-hole includes: the printed board 1 for arranging an electrolytic capacitor 2 (electronic component) thereon; through-holes 10 formed on the printed board 1 and soldering lead terminals 3 of the electronic capacitor 2 or the like thereto by lead-free solder 4; and a plurality of solder-holding auxiliary through-holes 20a, 20b, 21a, 21b formed in the vicinities of the through-holes 10 and electrically connected thereto. COPYRIGHT: (C)2010,JPO&INPIT |
