发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
The extent of a bow of a semiconductor device is suppressed in a case where the fillet width of an underfill resin is asymmetrical. The center position 12 of a chip 1 is caused to deviate from the center position 13 of a wiring substrate 2 in a direction (the direction of the arrow B) reverse to the deviation direction (the direction of the arrow A) of the center position 11 of an underfill resin 4 from the center position 12 of the chip 1. The center position 14 of a resin for encapsulation 6 is caused to deviate from the center position 13 of the wiring substrate 2 in the same direction (the direction of the arrow A) as the deviation direction (the direction of the arrow A) of the center position 11 of the underfill resin 4 from the center position 12 of the chip 1.
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申请公布号 |
US2010244228(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
US20100659766 |
申请日期 |
2010.03.19 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
SAKATA KENJI;KIDA TSUYOSHI |
分类号 |
H01L23/488;H01L21/56;H01L23/31 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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