THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

A three-dimensional semiconductor integrated circuit has first, second, third chips (11, 12, 13) stacked with each other. A second circuit (15) in the second chip (12) includes: a first inverter receiving first binary data (A) and outputting one of first and second potentials; and a first capacitor connected between the output end of the first inverter and a common conductor. A third circuit (16) in the third chip (13) includes: a second inverter receiving second binary data (B) and outputting one of third and fourth potentials; and a second capacitor connected between the output end of the second inverter and the common conductor.