| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress striation generated in a scribe line direction. <P>SOLUTION: In a semiconductor wafer substrate 1 on which a plurality of solid-state image pickup elements 2 are formed, in each groove formed in a surface of the substrate corresponding to each scribe line 3 between the adjacent solid-state image pickup elements 2, a pattern form (a metal wiring pattern 15A) of a metal wiring film 15 constituting the groove is embedded in a groove width direction disconnected with the metal wiring film 15, a silox protective film 16 protecting the entire surface of the substrate is formed on the metal wiring pattern 15A, and a scribe line embedding material 17 of a flat film is embedded in the groove which is reduced in width by the presence of the pattern form 15A. <P>COPYRIGHT: (C)2010,JPO&INPIT |
