| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be slimmed and miniaturized, has high mass productivity and can meet requirements of heat resistance. <P>SOLUTION: The semiconductor device has a structure in which a circuit pattern is formed by a conductive metal layer on a resin film to form a circuit board and electronic components are mounted on the circuit pattern of the circuit board. The circuit board has a region where a reinforcing metal layer not conducting to the circuit pattern is formed. Thus, even if a resin film is used as a base material of the circuit board, the reinforcing metal layer not conducting to the circuit pattern is formed and strength is imparted to the circuit board to remarkably improve handleability in a manufacturing process, and mass-productivity is improved. <P>COPYRIGHT: (C)2010,JPO&INPIT |
