发明名称 SYSTEM AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a system and a method for treating a substrate reducing power consumption without sacrificing throughput. SOLUTION: The system for treating a substrate 10 includes: a transport part 15; a first treatment chamber 16; a second treatment chamber 18; and a main control part 30. The transport part 15 includes a transport robot 22 for transporting a workpiece 20. The first treatment chamber 16 and the second treatment chamber 18 are arranged around the transport part 14. The first treatment chamber 16 and the second treatment chamber 18 include doors 162, 182 openable/closable in carrying in/out the workpiece 20, respectively. The main control part 30 controls the operations of the transport robot 22 and the doors 162, 182 so that the transport robot 22 alternately accesses the first treatment chamber 16 and the second treatment chamber 18 without continuously accessing either of them. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010219383(A) 申请公布日期 2010.09.30
申请号 JP20090065793 申请日期 2009.03.18
申请人 KOYO THERMO SYSTEM KK 发明人 MORI KOICHI;YOSHIHARA KENICHI;MUKAI MASAYUKI
分类号 H01L21/027 主分类号 H01L21/027
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