发明名称 Thermal Management For LED Lighting
摘要 A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.
申请公布号 US2010246178(A1) 申请公布日期 2010.09.30
申请号 US20090414690 申请日期 2009.03.31
申请人 HEATRON, INC. 发明人 GIARDINA RICHARD N.;DEUTSCHLANDER G. JAMES;FETSCHER BRIAN S.;SADCHIKOV ANDREY Y.;ZABAWSKI HENRICK A.
分类号 F21V21/00;F21V29/00;H01J9/24 主分类号 F21V21/00
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