| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a glass-sealed package, and a glass substrate used for the glass-sealed package, whereby an amount of warp in a glass substrate is reduced to improve processing accuracy in a subsequent step in which the glass is combined (such as by anodic bonding) with another glass substrate provided with a thin film. <P>SOLUTION: The front side of the glass substrate includes a no-cavity region where the cavities used to house electronic devices such as semiconductor IC chips and crystal blanks are not formed. The region devoid of the cavities is provided in a form of a frame to reduce an amount of warp in the glass substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
