| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor device and a method of manufacturing the semiconductor device, which can provide effective manufacturing processes and can reduce manufacturing cost. SOLUTION: The apparatus 100 for manufacturing the semiconductor device includes wafer cassettes 2, 3, 4, a device 5 for cleaning and modifying a surface of a wafer, a device 6 for aligning the wafer, a device 7 for injecting material of a passivation film on a wafer surface, a device 8 for inspecting an outer appearance of the passivation film, a device 9 for thermally treating the passivation film, and a device 10 for conveying the wafer to the respective devices in a treatment order. The apparatus 100 for manufacturing the semiconductor device forms a pattern of the passivation film selectively on the cleaned wafer surface by using inkjet technique. Then, the pattern of the passivation film is inspected to determine whether the pattern satisfies a desired pattern condition. When the passivation film is formed in the desired pattern, heat treatment is carried out to cure and burn the passivation film. COPYRIGHT: (C)2010,JPO&INPIT |
