MOUNTING APPARATUS AND MOUNTING METHOD

摘要

Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip components. A mounting method is also provided. The mounting tact time of the chip component can be shortened even in the cases where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.