| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inter-layer connection substrate forming method with improved connectivity and reliability. <P>SOLUTION: After sorted and oriented, a unit cell is sent out via an output part 44 to an image transfer device 50. The image transfer device 50 is provided with an image writing device 70, and has a desired circuit pattern used for sending out the unit cell to each layer of the inter-layer connection substrate. After sent to the desired circuit pattern on a platen 60, the unit cell 30 is processed by a post-processing device 80. This process contains to compress the unit cells together at least in one dimension, and to sinter or heat the unit cells to bridge an insulating material. To compress the unit cells together, one unit cell having a conductive wire facing a conductive wire on another unit cell is taken out. These both two unit cells are pressed, and then heated, to form superior electrical connection and mount an inter-layer connection substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
