| 摘要 |
PROBLEM TO BE SOLVED: To easily separate an adhesive sheet from a semiconductor device, and to reduce a load on the semiconductor device upon peeling. SOLUTION: This peeling device 1 for separating the adhesive sheet 3 from the semiconductor device 2 stuck on the adhesive sheet 3 includes: a suction nozzle 10 for sucking and holding the semiconductor device 2 from the upper side; and peeling means 6a, 6b to press plate-like members 12 against the adhesive sheet 3 stuck with the semiconductor 2 at an acute angle from the upper side in the vicinities of edges of the semiconductor device 2, and to axially rotate the plate-like members 12. The peeling means 6a, 6b can rotate the plate-like members 12 while repeating inversion of the rotating direction. COPYRIGHT: (C)2010,JPO&INPIT |
