| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board small in thickness, a method of manufacturing the same, and a coverlay film. SOLUTION: This circuit board 300 includes a circuit substrate 130 composed of a base material 201 and a conductor circuit 203 formed on at least one-side surface side of the base material 201, and is covered with a coverlay film 100 used as an insulation cover layer of the conductor circuit 203. The coverlay film 100 is formed with a resin film 101 and an adhesive layer 105. A conductive layer 103 is arranged between the resin film 101 and the adhesive layer 105, so that the conductive layer 103 is electrically connected to the conductor circuit 203. This improves the bending characteristic and reliability of the circuit board 300. COPYRIGHT: (C)2010,JPO&INPIT
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