发明名称 CARBON-BASED FILMS, AND METHODS OF FORMING THE SAME, HAVING DIELECTRIC FILLER MATERIAL AND EXHIBITING REDUCED THERMAL RESISTANCE
摘要 Methods in accordance with aspects of this invention form microelectronic structures in accordance with other aspects this invention, such as non-volatile memories, that include (1) a bottom electrode, (2) a resistivity-switchable layer disposed above and in contact with the bottom electrode, and (3) a top electrode disposed above and in contact with the resistivity-switchable layer; wherein the resistivity-switchable layer includes a carbon-based material and a dielectric filler material. Numerous additional aspects are provided.
申请公布号 US2010245029(A1) 申请公布日期 2010.09.30
申请号 US20090415011 申请日期 2009.03.31
申请人 SANDISK 3D LLC 发明人 SCHRICKER APRIL D.;MAXWELL STEVEN
分类号 H01C7/00;H01C17/06 主分类号 H01C7/00
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