发明名称 THERMAL MODULE
摘要 A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together.
申请公布号 US2010243207(A1) 申请公布日期 2010.09.30
申请号 US20090504683 申请日期 2009.07.17
申请人 FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 LIU PENG;ZHOU SHI-WEN;CHEN CHUN-CHI
分类号 F28F13/00;F28F7/00 主分类号 F28F13/00
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