SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
摘要
A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
申请公布号
WO2010090827(A3)
申请公布日期
2010.09.30
申请号
WO2010US21462
申请日期
2010.01.20
申请人
FAIRCHILD SEMICONDUCTOR CORPORATION;JEREZA, ARMAND VINCENT C.;CALO, PAUL ARMAND;CRUZ, ERWIN VICTOR R.
发明人
JEREZA, ARMAND VINCENT C.;CALO, PAUL ARMAND;CRUZ, ERWIN VICTOR R.