A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proximate the blade tip that is configured to limit penetration of the blade tip during use thereof.
申请公布号
WO2010090778(A3)
申请公布日期
2010.09.30
申请号
WO2010US20024
申请日期
2010.01.04
申请人
ORTHODYNE ELECTRONICS CORPORATION;COPPERTHITE, THEODORE, J.