Verfahren zur Herstellung eines Halbleiterbauelements in Halbleiterchipgröße mit einem Halbleiterchip

摘要

A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the side edges, the rear side and the top side, on which surface-mountable external contacts are arranged. One embodiment includes power semiconductor components, wherein the metallic coating connects a rear side electrode to one of the surface-mountable external contacts on the top side of a power semiconductor chip.