METHOD OF CHEMICAL MECHANICAL POLISHING

摘要

PURPOSE: A chemical and mechanical polishing method is provided to protect a wafer material or an under-layer film from being damaged by reducing shear stress applied to a semiconductor. CONSTITUTION: A semiconductor wafer(10) rotates the same direction as the rotation direction of a carrier(34). A polishing pad(30) is attached on a rotary table(32). The diameter of the rotary table is larger than that of the semiconductor wafer. A backing film detachably fixes the semiconductor wafer to the carrier. The rotary speed ratio of the semiconductor wafer and the polishing pad is more than or equal to 2:1.