SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can decrease a cooling time of a processed wafer to improve throughput. SOLUTION: A thermal shielding plate 50 includes a cooling gas blowing part for spraying cooling gas on the wafer held on a board 38. The cooling gas blowing part includes a plurality of blowing holes as spraying ports of the cooling gas. The thermal shielding plate 50 is retreated in a position for preventing interference (a retreating position) when the wafer is received between a wafer transfer device 36a and the board 38. When the wafer (and the board 38) is cooled, the thermal shielding plate 50 moves between the wafer transfer device 36a and the board 38 (a cooling position) so as to absorb and shield heat radiated from the wafer (and the board 38). COPYRIGHT: (C)2010,JPO&INPIT