发明名称 SPACER SUBSTRATE AND HIGH-FREQUENCY MODULE
摘要 PROBLEM TO BE SOLVED: To provide a spacer substrate, along with a high-frequency module that uses the spacer substrate, which constitutes a cavity structure having a high electromagnetic shield characteristic against a high frequency circuit and has a shield effect against the signal flowing in a through hole of its own. SOLUTION: The spacer substrate 8 includes an insulating substrate which includes an insulating member and has an opening that penetrates, in thickness direction, a plurality of through hole wirings which are installed from one end face in thickness direction of the insulating substrate to the other end face, and arranged in discrete manner to surround the opening of the insulating substrate, an outside wall shield 10a which has the width similar to the thickness of the insulating substrate and is arranged to enclose the insulating substrate on the outer periphery of the insulating substrate, being electrically connected to a part of the through hole wirings, and an inside wall shield 10b which has the width similar to the thickness of the insulating substrate and is arranged to enclose the opening on the inner periphery constituting the opening of the insulating substrate, being electrically connected to a part of the through hole wirings. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010219131(A) 申请公布日期 2010.09.30
申请号 JP20090061427 申请日期 2009.03.13
申请人 TOSHIBA CORP 发明人 ISHIDA MASAAKI
分类号 H01L23/00;H01L23/02;H01L23/12 主分类号 H01L23/00
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