| 摘要 |
In a polishing composition, the concentration of one of either sodium ions or acetate ions is 10 ppb or less, or the concentrations of sodium ions and acetate ions are 10 ppb or less. The polishing composition preferably contains a water soluble polymer such as hydroxyethylcellulose, an alkali such as ammonia, and abrasive grains such as colloidal silica. The polishing composition is mainly used in polishing of the surfaces of semiconductor wafers such as silicon wafers, especially used in finish polishing of the surfaces of such wafers.
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