SILICON WAFER AND METHOD OF MANUFACTURING SAME

摘要

A method of manufacturing a silicon wafer has a wafer preparation process for performing a surface treatment of a silicon wafer, a stress setting process for setting a stress to be imposed on the wafer, an inspection process for inspecting flaws on a wafer surface, and a determination process for determining if the wafer satisfies the criterion. By the method, it is possible to manufacture a wafer having the fracture resistance to even millisecond annealing performed in an FLA (Flash Lamp Annealing) process.