Thermal transient suppression material and method of production

摘要

The present invention provides a high performance polymer-base material (10, 20, 30) capable of dissipating transient thermal energy generated by an electronic module, such as a heat-generating power device. The methods of the present invention involve adding a suitable thinner to reduce the viscosity and increase the volume of a polymer-base matrix material (12) so that a large amount of thermal absorbing particles (14, 22, 25) may be added. The final cured product may have a filler content of more than 80 weight %. Further, the present invention provides a new and reduced cost formulation of a polymer-base thermal transient suppression material (30) containing organic wax particles.