CIRCUIT BOARD WITH MULTI-LAYER METAL LINE STRUCTURE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: By using the metal wiring layer including the metal particle capped to polymer the circuit board and manufacturing method thereof having the metal wiring of multi-layered improves the adhesive force between substrate and the metal wiring. CONSTITUTION: A circuit board having the metal wiring of multi-layered comprises the substrate(100), and the first metal wiring layer(110) and the second metal wiring layer(120). The first metal wiring layer is formed on substrate. The surface of the first metal wiring layer has the first metal particle capped to polymer.