发明名称 |
STUD BUMPING APPARATUS |
摘要 |
<p>The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping. (Figure 3)</p> |
申请公布号 |
SG164280(A1) |
申请公布日期 |
2010.09.29 |
申请号 |
SG20070000078 |
申请日期 |
2004.07.01 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
KWAN KA SHING, KENNY;GUOSHEN HU;TINGYU HE;YIE MI;MO WONG YAM |
分类号 |
H01L21/60;H01L21/687;H01L23/485;(IPC1-7):B23K1/06 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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