发明名称 Electric power converter and mounting structure of semiconductor device
摘要 <p>An object of the invention is to provide an electric power converter able to reduce the number of parts and restrain the influence of noises from a power wiring section.</p><p>The electric power converter has a main circuit section 10 including a semiconductor module constituting one portion of an electric power converting circuit, and a cooling device for cooling the semiconductor module; a control circuit substrate section 2 electrically connected to a signal terminal of the semiconductor module, and having a control circuit for controlling the operation of the semiconductor module; and a power wiring section 3 connected to a main electrode terminal of the semiconductor module, and supplying an electric current to the semiconductor module and stopping the supply of the electric current. The main circuit section 10 is interposed between the control circuit substrate section 2 and the power wiring section 3. An electronic part constituting at least one portion of a voltage raising circuit connected to the semiconductor module is preferably arranged together in the power wiring section 3. </p>
申请公布号 EP2216891(A3) 申请公布日期 2010.09.29
申请号 EP20100004701 申请日期 2004.08.20
申请人 DENSO CORPORATION 发明人 HARADA, DAISUKE;ISHIYAMA, HIROSHI
分类号 H02M7/00;H01L;H02M1/12;H02M1/14 主分类号 H02M7/00
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