SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to reduce a mounting area of a substrate by reducing the number of semiconductor packages connected to a controller. CONSTITUTION: A semiconductor package includes a semiconductor chip, a lead, a first pin group(20), and a second pin group(20'). The lead is connected to the semiconductor chip and is exposed to the outside. The first pin group is exposed in one direction of the semiconductor chip and is connected to the first channel line of the controller. The second pin group is exposed in other direction of the semiconductor chip and is connected to the second channel line of the controller.