| 发明名称 |
THERMOSETTING RESIN COMPOSITION, EPOXY RESIN MOLDING MATERIAL, AND POLYVALENT CARBOXYLIC ACID CONDENSATE |
| 摘要 |
<p>The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150°C, as measured with an ICI cone-plate Brookfield viscometer.</p> |
| 申请公布号 |
EP2233507(A1) |
申请公布日期 |
2010.09.29 |
| 申请号 |
EP20090700600 |
申请日期 |
2009.01.09 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KOTANI, HAYATO;URASAKI, NAOYUKI;MIZUTANI, MAKOTO |
| 分类号 |
C08G59/42;C08K3/22;C08L63/00;H01L33/00;H01L33/48;H01L33/60 |
主分类号 |
C08G59/42 |
| 代理机构 |
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| 主权项 |
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