A SEMICONDUCTOR DEVICE PACKAGE INCLUDING FUSES

摘要

PURPOSE: It deactivates the bad semiconductor chip in the fault of the specific semiconductor chip and the semiconductor package including fuse continuously uses the semiconductor package. Yield and utilization ratio of the semiconductor package are improved. CONSTITUTION: A plurality of semiconductor chips(120, 130) is formed on the package substrate(110). A plurality of semiconductor chips comprises the respective chip pads(125, 135). The package substrate comprises mach the pad(115) and branch pad(117). Pad is at the same time electrically connected to Mach to a plurality of semiconductor chips.